New COM Express modules focus on interchangeability and scalability

There are a total of 13 module variants now available for conga-CS45, conga-BS45 and conga-BM45. The smallest version in range is the conga-CS45 COM Express Compact module with an Intel Celeron M 723 processor and an Intel GS45 chipset. It features 1.2GHz and a 1MB L2 cache, while supporting up to 4GB ddr3 SO-DIMM memory. It is 95 x 95mm and is suitable for mobile applications such as ruggedised handhelds. In the laboratory with SiSoft Sandra in Dhrystone ALU mode it achieves 7342MIPS with a power consumption of 10W. The conga-BS45 module (95 x 125mm) incorporates an Intel Core 2 Duo SU9300 processor, 1.2 GHz, 3MB L2 cache and the Intel GS45 chipset with support for up to 8GB ddr3 dual channel memory. The high end module is the conga-BM45 (95 x 125mm) with the Intel Core 2 Duo T9400 processor, 2.53GHz, 6MB L2 cache and the Intel GM45 chipset. The COM is designed to provide the required processor and graphics performance for applications such as gaming systems and can be equipped with up to 8GB ddr3 dual channel memory. In the laboratory it achieved 23,366 MIPS with a TDP of 35W. The two independent graphics pipelines can be used for 2x24 bit LVDS, SDVO, TV-Out, analogue VGA as well as new interfaces such as DisplayPort and HDMI. All COM Express modules are now available in series production volumes.