This is being described as a significant milestone in advancing ASIC design solutions for next-generation applications, including artificial intelligence (AI), high-performance computing (HPC), and AI-enabled vehicle.
Since it was established in 1993, Faraday has developed an extensive range of ASIC services, from frontend to backend development, helping customers to better realise their device performance and cost objectives.
In addition, the company offers robust business continuity planning and system management, ensuring long-term supply guarantees for ASICs. Faraday provides expert support for IP design and utilisation, delivering value-added IP services such as SoC/subsystem integration, IP customisation, and IP hardening.
“We are glad to be a part of Intel Foundry Accelerator Design Services Alliance,” said Flash Lin, COO of Faraday. “Intel Foundry's leading-edge RibbonFET process and innovative 2.5D/3D-IC packaging solutions for new-generation multi-tile chips align perfectly with our capability and resource commitment to excellence. This collaboration enables us to expand our service portfolio, catering to customers targeting advanced applications.”
“Our collaboration with Faraday is poised to expedite the realiaation of silicon-product concepts into successful production,” added Suk Lee, VP & GM of Ecosystem Technology Office, Intel Foundry. “Faraday's flexible business models across various stages of ASIC development, including Spec-in to GDS-in design, verification, implementation, and OSAT services, facilitates seamless end-to-end co-development and empowers the creation of next-generation custom SoC products.”
