The collaboration leverages GF’s 22FDX process technology platform and global manufacturing footprint to support NXP’s solutions. GF’s 22FDX chips will be manufactured in Dresden and Malta, New York, providing NXP with a geographically diverse supply for their customers.
The new collaboration, which builds on a long-term relationship between NXP and GF, will enable NXP to provide more compact and power-efficient solutions while increasing the overall performance of their system solutions.
The companies will leverage GF’s 22FDX platform, which optimises performance by dynamically adjusting to the lowest possible voltage, delivering ultra-low power consumption and high performance for the most demanding applications.
The 22FDX process was purpose-built for intelligence at the edge and optimises energy management to deliver up to a 50% higher performance while reducing power consumption by up to 70% when compared to other planar CMOS technologies.
“NXP’s portfolio of high-performance solutions is crucial to enabling the essential technologies at the centre of our increasingly connected world,” said Andy Micallef, executive vice president and chief operations and manufacturing officer at NXP. “GF’s 22FDX platform’s power efficiency and enhanced performance effectively enables our customers to build the next generation of connected and secure solutions. Additionally, GF’s robust manufacturing presence for 22FDX in Germany and the US helps support our goals of having supply control and geographic resilience in our manufacturing base.”
The 22FDX platform also maximises performance per area by integrating digital, analogue, RF, power management, and non-volatile memory (NVM) onto a single die. The platform also delivers responsive and reliable wireless connectivity for simple and secure connections.
Integrated NVM reduces power consumption and latency while improving security, which is especially important given the growing memory footprint for Edge AI processors.
Through this integration, NXP will be able to create a one-stop shop platform to serve multiple markets while maximizing IP reuse.
With technology qualified for Automotive Grade 1 and 2 applications, 22FDX ensures reliability in extreme automotive conditions and, as part of GF’s AutoPro solutions, the platform includes advanced temperature-resistant capabilities up to 150°C junction temperature, which is critical to ensuring the long-term durability and safety of vehicle electronic systems.
The two companies previously worked together on a joint development of 40nm NVM technology, so GF is well positioned to support NXP’s next-gen solutions using its FDX and FDX+ platforms.
