The new set of contracts will deepen the long-term partnership on SiC material and, according to the agreement, Resonac will supply Infineon with SiC materials for the production of SiC semiconductors, covering a double-digit share of the forecasted demand for the next decade.
While the initial phase focuses on 6" SiC material supply, Resonac will also support Infineon’s transition to 8" wafer-diameter during the later years of the agreement. As part of the cooperation, Infineon will provide Resonac with intellectual property relating to SiC material technologies.
The Infineon - Resonac partnership is intended to contribute to supply chain stability and will support the rapid growth of the emerging semiconductor material SiC.
”The demand for SiC is growing rapidly and we are preparing for this development with a significant expansion of our manufacturing capacities," said Angelique van der Burg, Chief Procurement Officer at Infineon. "We are pleased to deepen our collaboration with Resonac and strengthen the partnership between our two companies."
"The business opportunities in the area of renewable energy generation and storage, electromobility and infrastructure are enormous for the years to come. Infineon is doubling down on its investments into SiC technology and product portfolio, to proliferate the most comprehensive product offering to its customers," said Peter Wawer, President of Infineon’s Industrial Power Control division.
Infineon is currently expanding its SiC manufacturing capacity in order to reach a market share of 30 percent by the end of the decade. Infineon’s SiC manufacturing capacity is about to increase tenfold by 2027. A new plant in Kulim is scheduled to start production in 2024.
Currently, Infineon provides SiC semiconductors to more than 3,600 customers worldwide.
