The company said that it was about to release the first products based on its advanced 200 mm SiC technology to customers in Q1 2025. The products, manufactured in Villach, Austria, provide SiC power technology for high-voltage applications, including renewable energies, trains, and electric vehicles.
In addition, the transition of Infineon's manufacturing site in Kulim, Malaysia, from 150-millimeter wafers to the larger and more efficient 200-millimeter diameter wafers is fully on track.
The company said that the newly built Module 3 is poised to commence high-volume production aligned with market demand.
“The implementation of our SiC production is progressing as planned and we are proud of the first product releases to customers,” said Dr. Rutger Wijburg, Chief Operations Officer of Infineon. “By ramping up SiC production in Villach and Kulim in phases, we are improving cost-efficiency and continuing to ensure product quality. At the same time, we are making sure our manufacturing capacities can meet the demand for SiC-based power semiconductors.”
SiC semiconductors are helping to revolutionise high-power applications by switching electricity even more efficiently, demonstrating higher reliability and robustness under extreme conditions, and by making even smaller designs possible.
Infineon’s SiC products are enabling customers to develop more energy-efficient solutions for electric vehicles, fast charging stations and trains as well as renewable energy systems and AI data centres.
The release to customers of the first SiC products based on the 200-millimeter wafer technology will be a substantial step forward in Infineon’s SiC roadmap, with a strong focus on providing customers with a comprehensive portfolio of high-performance power semiconductors that promote green energy and contribute to CO 2 reduction.
Infineon’s production sites in Villach and Kulim share technologies and processes which allow for fast ramping and smooth and highly efficient operations in SiC and gallium nitride (GaN) manufacturing.
