The CYW20829 product family is highly integrated, which allows designers to reduce bill-of-material (BOM) costs and device footprint in a wide variety of applications, including PC accessories, low-energy audio, wearables, solar micro inverters, asset trackers, health and lifestyle, and home automation.
According to Infineon, product designers will also benefit from the company’s development infrastructure and commitment to security, with support for secure boot and execution environments and cryptography acceleration to safeguard sensitive data.
Among the new parts available is an automotive part, the AIROC CYW89829 Bluetooth Low-Energy MCU, which is intended for car access and wireless battery management systems (wBMS) applications, due to its robust RF performance, long range and latest Bluetooth 5.4 features including PAwR (Periodic Advertising with Responses).
The dual ARM Cortex core design of the chip family features separate application and Bluetooth Low Energy subsystems that deliver full featured support for Bluetooth 5.4, low-power, 10 dBm output power without a PA, integrated flash, CAN FD, crypto accelerators, high security including Root of Trust (RoT), and is PSA level 1 ready.
“Our Bluetooth solutions offer robust connectivity and the latest features,” said Shantanu Bhalerao, Vice President of the Bluetooth Product Line, Infineon Technologies. “Our automotive AIROC CYW89829 Bluetooth LE MCU, and versatile AIROC Bluetooth CYW20829 LE MCU deliver ultra-low power and a high degree of integration for a better user experience across various applications in automotive, industrial, and consumer markets.”
Infineon has been working with customers to design with current products in the CYW20829 family and the new products are available in a range of variants, each with its specific characteristics and focus applications.
Products currently in production are:
CYW20829B0000, in a 56QFN SoC package, 6x6 mm, designed for PC accessories, remotes, ESL, and low-end BLE MCUs
CYW20829B0010, packaged in 56QFN SoC with a dimension of 6x6 mm, suitable for gaming accessories and LE Audio products
CYW20829B0-P4EPI100 and CYW20829B0-P4TAI100 modules, both with a dimension of 14.5x19 mm, suitable for long-range, asset tracking, power tools, and generic Bluetooth LE use cases.
Sampling now are:
CYW20829B0021, in a 40QFN SoC package, 6x6 mm, suited for industrial and long-range applications
CYW89829B0022, in a 40QFN SoC package 6x6 mm, designed for wireless BMS and car access
CYW89829B0232, in a 77BGA SoC package, 7x8 mm, suitable for wireless BMS and car access
In the second quarter of 2025, samples are expected of the CYW20829B1230, which will be available in a 64 Ball BGA SoC package with a dimension of 4.5x4.5 mm and is intended for wearables, power tools, and asset tracking.
