The CYW20822-P4TAI040 offers seamless integration and enhanced performance with Bluetooth low-energy long-range (LE-LR) support and provides improved reliability for a wide range of applications.
By combining low power and high performance, the module is designed to support the entire spectrum of Bluetooth LE-LR use cases including industrial IoT applications, smart home, asset tracking, beacons and sensors, and medical devices.
Future use cases are expected to demand additional improvements across almost all metrics so Infineon's Bluetooth module looks to provide both enhanced connectivity and performance, enabling customers to create more competitive products in the IoT and consumer electronics space.
With extensive experience in delivering certified Bluetooth and Bluetooth LE modules, Infineon’s regulatory testing (FCC, ISED, MIC, CE) and certification process with the Bluetooth SIG is precise and rigorous. Its pre-certified modules are optimised for cost, size, power, and range.
Key features of the CYW20822-P4TAI040 Bluetooth module
Connectivity: The CYW20822-P4TAI040 module utilises the latest Bluetooth 5.0 technology to support 1M, 2M & Coded PHY along with advertisement and data extension. This ensures seamless and stable wireless connectivity Bluetooth low-energy and long-range connections.
Energy Efficiency: Infineon's advanced power management techniques in the CYW20822-P4TAI040 module enable optimised energy consumption, prolonging battery life in portable devices. As part of its decarbonisation and digitalisation efforts, the module has a very low active power consumption of 1.3 mA (Rx @ -95 dBm) and 3 mA (Tx @ 0 dBm), along with a sleep current consumption of 2 μA with 32 KB RAM retention.
Zero-Programming: The CYW20822-P4TAI040 module is pre-programmed via the EZ-Serial firmware to eliminate customer programming. This helps accelerate the time-to-deployment for Bluetooth-enabled IoT solutions.
Compact Design: With its compact form factor of 10.5 x 20.2 x 2.3 mm³, the CYW20822-P4TAI040 module offers ease-of-integration into various IoT devices, wearables, and other space-constrained applications.
