These modules have been designed to enable true vertical power delivery (VPD) and offer the industry's best current density of 1.6 A/mm 2. They follow the TDM2254xD dual-phase power modules introduced by Infineon earlier this year.
Data centres are currently responsible for more than two percent of global energy consumption and fuelled by AI, this number is expected to grow to up to around seven percent by 2030, matching the current energy consumption of India. Consequently, enabling efficient power conversion from grid-to-core is vital to enable superior power densities and thereby advance compute performance while reducing total cost of ownership (TCO).
“These devices will maximise system performance thereby enabling best TCO for data centres,” said Rakesh Renganathan, Vice President Power ICs at Infineon Technologies. “Our industry-leading power devices and packaging technologies, combined with our extensive systems expertise, will further advance high-performance and green computing as part of our mission to drive digitalisation and decarbonisation.”
The TDM2354xD and TDM2354xT modules combine Infineon's OptiMOS 6 trench technology, a chip-embedded package that enables superior power density through enhanced electrical and thermal efficiencies, and a new inductor technology to enable lower profile and therefore, true vertical power delivery.
As a result, the modules are said to set new standards in power density and quality so as to maximise the compute performance and efficiency of AI data centres.
The TDM2354xT modules support up to 160 A and are the industry's first Trans-Inductor Voltage Regulator (TLVR) modules in a small 8 x 8 mm² form factor. Combined with Infineon's XDP controllers, they offer extremely fast transient response and minimise on-board output capacitance by up to 50 percent, further increasing system power density.
