Infineon tapes out first 300mm wafers for power market
Infineon has produced the first ever chips on a 300mm wafer for the power semiconductor market.
Developed at the firm's Villach site in Austria, the chips are said to exhibit the same behavior as the power semiconductors made on 200mm wafer, and have been demonstrated by application tests using mosfets for high voltage applications.
"Our engineers' achievement marks a quantum leap in production technology," stated Dr Reinhard Ploss, Operations, Research & Development and Labor Director of Infineon Technologies AG. "Innovation lays the foundation for profitable growth. Innovation secures our edge over the competition."
Infineon had embarked on setting up a power semiconductor pilot line for 300mm wafer and thin wafer technology in October 2010. The team today comprises 50 engineers and physicists from the fields of research and development, manufacturing technology and marketing.
