Infineon qualifies thinned wafer power semiconductor process
Infineon Technologies has claimed a 'major breakthrough' in the manufacturing of power semiconductors on 300mm thin wafers, having completed qualification of the process from start to finish and receiving approval from customers.
"Infineon put its faith in this manufacturing technology very early on and continued to invest, even in economically difficult times.
The qualification of our entire 300mm line represents a veritable leap ahead of the competition," said Dr Reinhard Ploss, Infineon's ceo. "Manufacturing power semiconductors on 300mm thin wafers will enable us, with the corresponding demand, to seize the opportunities that the market offers."
Having qualified the manufacturing process at its Villach facility, Infineon will implement it at Dresden, where the focus will be on high volume production on a fully automated 300mm line.
Technology transfer to Dresden is said to be running on schedule and qualification of the first CoolMOS products will be completed in March.
