Intel extends chip deal with Altera

The deal builds on an earlier agreement announced last year for Altera to use Intel to build fpgas at the 14nm node. The new multi-die chips will integrate Altera's 14nm Stratix 10 FPGAs and SoCs with other advanced components, including DRAM, SRAM, ASICs and processors, in a single package. Altera says the devices will address the performance, memory bandwidth and thermal challenges impacting high end applications in the communications, high performance computing, broadcast and military segments. Brad Howe, pictured, the company's senior vice president of research and development, commented: "Our collaboration with Intel on heterogeneous multi-die device development reflects a shared commitment by both companies to improve the bandwidth and performance of next-generation systems. "Leveraging Intel's advanced manufacturing and chip packaging capabilities will allow Altera to deliver system-in-a-package solutions that have been identified as critical to meeting overall performance requirements."