Among those companies in the early access program are Colorado Engineering, Mantaro Networks, Microsoft and Silicom who will be using Agilex FPGAs to develop advanced solutions for networking, 5G and accelerated data analytics.
“The Intel Agilex FPGA product family leverages the breadth of Intel innovation and technology leadership, including architecture, packaging, process technology, developer tools and a fast path to power reduction with eASIC technology. These assets enable new levels of heterogeneous computing, system integration and processor connectivity and will be the first 10nm FPGA to provide cache-coherent and low latency connectivity to Intel Xeon processors with the upcoming Compute Express Link," said Dan McNamara, Intel senior vice president and general manager of the Networking and Custom Logic Group.
Increased data usage and 5G means that networking throughput is increasing, and latencies must decrease. The Agilex FPGAs have been designed to provide the greater flexibility and agility that's required to meet these challenges by delivering significant gains in performance and inherent low latency.
Reconfigurable and with reduced power consumption, these FPGAs have computation and high-speed interfacing capabilities that enable the creation of higher bandwidth networks and help deliver real-time, actionable insights via accelerated artificial intelligence (AI) and other analytics performed at the edge, in the cloud and throughout the network.
“Microsoft has been working closely with Intel on the development of their Intel Agilex FPGAs and we are planning to use them in a number of upcoming projects. Intel FPGAs have provided tremendous value for us for accelerating real-time AI, networking, and other applications/infrastructure across Azure Cloud Services, Bing, and other data centre services," said Doug Burger, technical fellow, Azure Hardware Systems at Microsoft
The Intel Agilex family combines several innovative Intel technologies including the second-generation HyperFlex FPGA fabric built on Intel’s 10nm process, and heterogeneous 3D silicon-in-package (SiP) technology based on Intel’s embedded multi-die interconnect bridge (EMIB) technology. This combination allows Intel to integrate analogue, memory, custom computing, custom I/O and Intel eASIC device tiles into a single package along with the FPGA fabric and allows developers to seamlessly migrate their designs from FPGAs to structured ASICs.
Intel Agilex FPGAs provide innovative new capabilities to help accelerate the solutions of tomorrow. Innovations include:
- Compute Express Link: Industry’s first FPGA to support upcoming Compute Express Link (CXL), a cache and memory coherent interconnect to future Intel Xeon Scalable processors.
- 2nd-generation HyperFlex architecture: Up to 40% higher performance or up to 40% lower total power2 compared with Intel® Stratix 10 FPGAs1.
- DSP innovation: Only FPGA supporting hardened BFLOAT16, with up to 40 teraflops of digital signal processor (DSP) performance (FP16)3.
- Peripheral component interconnect express (PCIe) Gen 5: The ability to scale for higher bandwidth compared with PCIe Gen 4.
- Transceiver data rates: Support up to 112 Gbps data rates for high-speed networking requirements for 400GE and beyond.
- Advanced memory: Support for current DDR4, and upcoming DDR5, HBM, and Intel® Optane DC persistent memory.
