This new line-up utilises KIOXIA’s latest generation BiCS FLASH 3D flash memory with 3-bit-per-cell (triple-level cell, TLC) technology, and is available in a 132-BGA package.
Densities range from 512 gigabits (64 gigabytes) to 4 terabits (512 gigabytes) to support the requirements of industrial applications - including telecommunication, networking, and embedded computing.
The memory requirements for many industrial applications are very different to those of SSDs designed to be housed in climate-controlled data centres – including the need for extended temperature ranges and the ability to maintain high reliability and performance in rugged operating conditions. Designed with these needs in mind, these new devices support a wide temperature range (-40°C to +85°C).
The devices have the ability to convert Triple-Level Cell (TLC) flash memory (3-bits per cell) to Single-Level Cell (1-bit per cell) mode – improving performance and reliability.
“KIOXIA is committed to supporting multiple industrial-grade solutions and accommodating applications that have long life cycles. With the addition of next-generation Industrial Grade BiCS FLASH 3D flash memory, we can now present an efficient and highly reliable embedded memory solution for environments requiring a wider temperature range and increased support for the processor,” said Axel Stoermann, KIOXIA Europe GmbH.
KIOXIA also offers wide temperature range (-40°C to +85°C) low density SLC flash memory solutions designed to support industrial applications.
