MEMs processing module unveiled
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Point 35 Microstructures and the Fraunhofer Institute have unveiled a module solution for advanced MEMS processing.
The module enables an amporphous silicon film to be deposited as a sacrificial etch layer in a modified PECVD reactor. This layer can then be etched using the memsstar SVR system.
Mike Leavy, Point 35's ceo, said: "The ability to implement qualified sacrificial etch schemes using efficient proven equipment enables MEMS organisations to reduce development time and get their new devices to market faster."
According to the partners, the module has fully characterised etch selectivity to many other materials, fast etch rates and excellent uniformity and repeatability. This integrated process sequence can be used within standard cmos facilities and on top of cmos wafers if required which will enable many possible new applications.
Professor Holger Vogt from Fraunhofer IMS said: "We have developed thin and thick film technology which can be doped or undoped and will enable MEMS devices to be created using standard materials within existing wafer fabs and on standard equipment."
Applications for MEMs devices created in this way include motion sensors, micro displays, silicon microphones, fluidic channels, bolometer arrays and pressure sensors.
