Microsemi emerges as latest Intel foundry customer
Intel is to manufacture digital ic solutions and SoCs for Microsemi using its 22nm FinFET process technology.
The deal, signed in January this year, makes the Californian firm Intel's fifth publicly disclosed foundry customer.
"The high value applications we address require semiconductor solutions with unique performance and complex functional attributes," said Paul Pickle, executive vice president of Microsemi's ic business.
"Using Intel's innovative process technology and silicon proven IP will enable us to expand our opportunity in the markets we serve with higher performance, lower power digital ics for the communications and defence markets."
Microsemi says it is currently engaged with customers and has started designs utilising Intel's 22nm process node.
The first devices are expected to be avilable in late 2014 to early 2015.
