Moortec’s embedded sensing technology enables the assessment of key chip parameters both during production test and the measurement of real- time dynamic conditions during mission mode.
In-chip sensing continues to be an essential element to achieving the highest levels of performance and reliability within today’s advanced process technologies, underpinning optimisation schemes, telemetry and semiconductor lifecycle analytics.
“Our long-term collaboration with TSMC has allowed us to listen closely to customers and understand their needs, which in turn allows us to deliver the sensing solutions that provide real-time insights deep within the chip,” explained CEO Moortec Steve Crosher.
“We’re pleased with the result of our collaboration with Moortec in delivering its sensing solution on TSMC’s N6 process to address the design challenges on increased computing power for leading-edge mobile and high performance computing applications,” said Suk Lee, Senior Director of Design Infrastructure Management Division at TSMC. “We look forward to a continued partnership with Moortec to support our mutual customers with design solutions benefiting from the power and performance boost of TSMC’s most advanced process technologies.”
TSMC's N6 process provides significant power and performance enhancements and offers customers a significant performance-to-cost advantage for a broad array of applications, ranging from high-to-mid end mobile, consumer applications, AI, networking, 5G infrastructure, GPU, and high-performance computing.
