New packaging could enable miniaturised implantable medical devices
Microsemi has unveiled a new die packaging technology targeted at implantable medical devices which is said to offer a radio module footprint reduction of 75%.
The company says the technology has passed an internal qualification regime for active implantable medical devices consisting of thermal and mechanical stressing to MIL-STD-883 test standards.
The packaging can be used for pacemakers and cardiac defibrillators, as well as wearable devices such hearing aids and intelligent patches, or nerve stimulators and drug delivery products.
"This internal die packaging technology qualification aligns with our customers' required parameters, providing a solution to drive the development of miniaturised wireless medical products," said Martin McHugh, business and technology development manager of advanced packaging at Microsemi. "Our advanced packaging technology can also be paired with our industry leading, ultra low power ZL70102 radio to enable wireless healthcare monitoring."
