NXP mosfets offer ‘best in class’ thermal performance

The LFPAK33 portfolio incorporates copper clip and solder die attach technologies, features a junction temperature of 175°C and is available in a 3.3 x 3.3mm package. The devices are optimised for switching at high temperatures and are said to reduce the risk of solder joint failure and package case cracking by allowing exposed source and gate pins to safely absorb thermal and mechanical stress. "The never ending trend to miniaturisation in power switching applications is driving the need for mosfet packages that can reliably handle system power requirements while minimizing the pcb space required," said Dr Dilder Chowdhury, product marketing manager, standard mosfets at NXP. "These packages have been designed for reliability, with best in class thermal performance. There's no other solution available that delivers this degree of robustness and power in such a small package." The LFPAK33 devices are compatible with QFN and DFN3333 packages, with a pcb footprint fully tested by Norcott Technologies.