According to the companies, they are delivering a solution that can reduce design times, improve time-to-market and save board space in next generation Wi-Fi 6 implementations.
The NCP FEIC is tightly packed in a chip scale package (CSP) suitable for module integration and can support various 5G smartphones and portable computing devices. In addition, it enables high performance 2x2 multiple input multiple output (MIMO) functionality.
“Murata is pleased to work with NXP to develop RF front-end modules for Wi-Fi 6 platforms — NXP’s monolithic front-end ICs are fully verified in leading Wi-Fi 6 platforms and offer perfect flexibility in terms of size and integration,” said Katsuhiko Fujikawa, R&D Manager of Murata Manufacturing. “We plan to continue working with NXP and hope to develop newer modules in forthcoming years that support new spectrums and standards.”
“Working with Murata helps manufacturers deliver a highly integrated, fully tested and qualified solution for 5G devices while providing the highest performance and smallest size to meet rapidly rising global demand for Wi-Fi 6,” said Paul Hart, Senior Vice President and General Manager of NXP’s Radio Frequency business.
