COM-HPC defines five module sizes to deliver edge server performance for small, rugged data centers. The specification addresses emerging requirements in the embedded and edge computing market.The base specification will be accompanied later this year by a Platform Management Interface Specification, COM-HPC EEEP, and a Carrier Board Design Guide.
“The PICMG organisation is proud of the extraordinary collaboration between industry leaders that has led to the completion of the COM-HPC base specification, said Jess Isquith, president of PICMG. “The new open standard will enable multiple AI and Industry 4.0 applications, amongst others, to be realised by bringing server-level computing to the edge. Adopting the specification provides a necessary standard to reduce time to market and stabilize costs for hundreds of solutions providers.”
The specification covers two classes of modules:
The COM-HPC Client Module Type targets use in high end embedded client products that need one or more displays, a full set of low, medium, and extremely high bandwidth I/O, powerful CPUs and modest size. Typical uses are in medical equipment, high end instrumentation, industrial equipment, casino gaming equipment, ruggedized field PCs, transportation and defense systems and much more.
The COM-HPC Server Type targets use in high end headless (no display) embedded servers that require intensive CPU capability, large memory capacity, and lots of high bandwidth I/O including multiple 10Gbps or 25Gbps Ethernet, and up to 65 PCIe lanes, at up to PCIe Gen 5 speeds.
Typical uses are in embedded server equipment ruggedized for use in field environments and applications such as autonomous vehicles, cell tower base stations, geophysical field equipment, medical equipment, defense systems and much more. Both client and server modules have a dedicated platform management interface which is the first for a COM standard to include remote administration.
This new specification does not replace COM Express, which will continue to play a crucial role in the COM marketplace for many years.
The specification documents are available for download on the PICMG website -follow the link below.
