The COM-HPC standard enables modular and scalable computing solutions with server-class bandwidth, power, and performance. This module represents the next generation of COM-E (COM Express) technology, with significantly improved performance. It is based on open standards, developed by the industry consortium, PICMG (PCI Industrial Computer Manufacturers Group).
The TCA 6710 and COM-HPC module combination meets the demand for high-performance, low-power, but flexible computing platforms for a wide-range of applications including IoT, edge server, AI, and network security, requiring less time and effort for software porting and development.
The COM-HPC module is powered by the Marvell OCTEON 10 CN10308 – an 8-core processor that leverages the latest Arm v9 Neoverse N2 architecture and delivers nearly three times the performance of the previous generation. In addition, Marvell’s OCTEON 10 DPU (Data Processing Unit) has reduced power consumption by as much as 50 percent compared to the previous OCTEON generation, providing advanced performance per watt (compared to the OCTEON TX2 CN9130).
The carrier board supports PCIe Gen 5 and the OCTEON module supports DDR5, offering the highest memory and I/O bandwidth in its class.
The TCA 6710 carrier board also offers rich Ethernet capabilities, with speeds from 1GbE up to 25GbE and so can support diverse network connectivity and throughput requirements suitable for almost any edge or cloud application.
The system also provides wireless communication options, such as Wi-Fi and LTE/5G to enable seamless data transmission and management. Additionally, the TCA 6710 supports the NEXCOM TPM 2.0 module and RunBMC (Baseboard Management Controller) module for enhanced security and remote management capabilities.
The TCA 6710’s modular design allows for easy customisation and upgradability. Users can also choose from different carrier boards that provide various features and interfaces to suit their specific needs.
This design offers advantages such as time and cost savings in adapting to various applications and maintaining effective functionality years into the future. This flexible and open design enables customers to procure COM-HPC modules separately, and seamlessly integrate them with their own carrier boards.
