Power package miniaturisation exceeds appliance safety standards
STMicroelectronics has introduced a new package designed to enable further miniaturisation of control modules that need to meet strict safety specifications such as IEC 60370 and IEC 60335.
The company is initially using its new three lead surface mount package, SMBflat to house products such as an ac switch, a silicon controlled rectifier (scr) and three types of Triac - widely used in circuits such as valve, motor or pump controls, lamp igniters and circuit breakers.
Occupying half the pcb area of closest rival SOT-223, the new package allows ST's new ACS108 1-Amp ac switch to achieve the highest ever current density. The SMBflat package is also 40% skinnier than the SOT-223. ST says the 'creepage' distances of the X02 series SCRs and Z01 series Triacs, which use this new package, will help meet the insulation requirements of the major safety standards for domestic and industrial electrical equipment.
