Pushing the boundaries

Exception has announced the registration of several trademarks and one patent relating to its high density interconnect (HDI) processes. The company has implemented several techniques and technologies in the field of pcb development, including its microvia tower process, eXMVT, its VteX process for copper filled vias, and its flat pad technology service offering, eXFPT. “Chip designers are increasingly looking for more functionality from pcbs and substrates that are reducing in size,” said Exception’s sales and marketing director of pcb business, Garry Myatt. “Industries such as computing, telecommunications and defence are constantly pushing forward the technical barriers to gain more processing power, increasing temperature or circuit failure.”