Qualcomm to assess Leti’s 3d technology
Qualcomm Technologies has signed an agreement that will allow it to assess the feasibility and value of CEA-Leti's sequential 3d technology in practical applications.
Recently, Leti has been developing a 3d integration technology process that enables active layers of transistors to be stacked. In comparison with through silicon via approaches, which allows separate dice to be stacked,
Leti's sequential 3d technology is said to allow all functions to be processed in one manufacturing flow. This, Leti adds, allows active areas to be connected at the transistor level at very high density using a standard lithography process.
The approach is expected to produce a 50% gain in area and a 30% gain in speed compared to the same generation of technology made in classical 2d. Leti claims these gains are comparable to those which are expected from next generation 2d technology, but in a less complex and less expensive way.
