According to Rambus, the acquisition will help to augment its team of engineers and will accelerate the development of CXL processing solutions for next-generation data centres. Hardent has developed extensive silicon design, verification, compression, and Error Correction Code (ECC) expertise which will provide key resources for the Rambus CXL Memory Interconnect Initiative.
“Driven by the demands of advanced workloads like AI/ML and the move to disaggregated data centre architectures, industry momentum for CXL-based solutions continues to grow,” said Luc Seraphin, president and CEO of Rambus. “The addition of the highly-skilled Hardent design team brings key resources that will accelerate our roadmap and expand our reach to address customer needs for next-generation data centre solutions.”
Hardent brings complementary IP and services to the Rambus Silicon IP portfolio, expanding the customer base and design wins in automotive and consumer electronic applications. The transaction is expected to close in the second calendar quarter of 2022 and will not materially impact results.
