Research project looks to the nanoscale
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With miniaturisation of electronic components pushing towards the nanoscale, engineering challenges are growing. In a move to address these challenges, a consortium of leading microelectronics companies and research institutions has announced a European initiative aimed at improving engineering efficiency. The project, called NanoInterface, has won funding under the European Union's Seventh Framework Program.
A number of scientific, technological and societal advances are expected, including the development of a multiscale approach, a shorter time to market and fewer redesign cycles for microelectronic materials. Other benefits include a contribution towards the 'zero defect' objectives of the industry and the implementation of environmentally friendly materials.
Models at the atomic level will be explicitly coupled to macroscopic (finite element) models. To support this 'bottom up' approach, the partners will develop a software tool will incorporates chemical, physical and mechanical information from the atomic level directly into the macroscopic models. This, says the initiative, will enable computational design towards highly reliable metal oxide-polymer systems for System in Package products and complex micro- and nanoelectronic systems with applications in various industries.
The consortium is led by Philips Applied Technologies and its membership includes Fraunhofer IZM, Georgia Institute of Technology Lorraine, Infineon and NXP.
