RFaxis samples pure cmos silicon rf front end IC chips
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Fabless semiconductor specialist, RFaxis has announced that it is sampling the world's first and only pure cmos silicon single chip/single die rf front end integrated circuits (RFeIC) manufactured at multiple foundries using standard cmos processes.
Mike Neshat, president and ceo of RFaxis, said: "We have clearly proved wrong those who claimed it is impossible to design and deliver silicon based plug & play, single chip/single die RFeICs as we have. Berkana Wireless (acquired by Qualcomm in 2006) stated that integrating both the radio and baseband functions on a monolithic cmos silicon die is considered the Holy Grail, especially for cellular phones.
"Not only have we defied conventional thinking and revolutionised the rf front end space, we have also achieved this Holy Grail for strategic players in the wireless and connectivity markets by enabling cmos integration of the rf front end as an integral part of this monolithic silicon die. This could never be done before because rf front end solutions are typically built from costly gallium arsenide that simply cannot be integrated with silicon. We have truly bridged the rf gap."
