Samsung goes green with 30nm class ddr3 ram
1 min read
South Korea's Samsung Electronics has developed 30nm class 32GB ddr3 registered dual inline memory modules (RDIMMs), which utilise 3d through silicon via package technology.
Sampling now, Samsung claims the units deliver a substantially greener memory solution compared to 40nm class based devices. They are based on the company's 4Gb ddr3 and transmit at speeds at up to 1,333Mbps.
"These 32GB RDIMMs fully support the high density and high performance requirements of next generation high capacity servers," said Wanhoon Hong, executive vp, memory sales and marketing, Samsung Electronics. "We will keep providing memory solutions with higher performance and density, while enhancing shared value in the design of ever greener server systems."
Consuming less than 4.5W per hour, Hong claims the 32GB module has the lowest power consumption level among memory modules adopted for use in enterprise servers.
These savings are said to attributable to the adoption of TSV technology, which enables a multi stacked chip to function at levels comparable to a single silicon chip by shortening signal lines significantly, lowering power consumption and achieving higher density and operational speed.
