Samsung ‘one step ahead of Intel’ in 3d manufacturing, report claims
According to a Korean source, Samsung Electronics has finished developing 3d semiconductor manufacturing technology and is, in effect, one step ahead of Intel.
The source claims Samsung has been working on 3d manufacturing at the 50nm node, refining the technology by building 1Gbyte drams, and that the technologies involved can be applied at the 20nm node. It is believed that 3d technology will be used to build application processors for mobile phones.
A Samsung spokesperson said: "It is true that we have secured 3d semiconductor techniques, but we find it unnecessary as of now to apply those to the production of mobile application processors as we are faring well even without resorting to it. We are now keeping an eye on global demands and market situations, mulling over when to put them to use."
Meanwhile, news reports claim Elpida, Powertech and UMC have entered a three way collaboration to deliver 3d integration technologies at the 28nm node.
