Samsung can deliver ultra-slim LPDDR5X DRAM packages that can create additional space within mobile devices, facilitating better airflow. This supports easier thermal control, a factor that is becoming increasingly critical especially for high-performance applications with advanced features such as on-device AI.
"Samsung’s LPDDR5X DRAM sets a new standard for high-performance on-device AI solutions, offering not only superior LPDDR performance but also advanced thermal management in an ultra-compact package," said YongCheol Bae, Executive Vice President of Memory Product Planning at Samsung Electronics. "We are committed to continuous innovation through close collaboration with our customers, delivering solutions that meet the future needs of the low-power DRAM market."
With the new LPDDR5X DRAM packages, Samsung is now offering the industry’s thinnest 12 nm-class LPDDR DRAM in a 4-stack structure, reducing the thickness by approximately 9% and improving heat resistance by as much as 21%, compared to the previous generation product.
According to Samsung, by optimising printed circuit board (PCB) and epoxy moulding compound (EMC)2 techniques, the LPDDR DRAM package is as thin as a fingernail at 0.65mm, which is the thinnest among existing LPDDR DRAM of 12GB or above.
Samsung’s optimised back-lapping process is also used to minimise the package height.
Samsung said that it plans to continue expanding the low-power DRAM market by supplying its 0.65mm LPDDR5X DRAM to mobile processor makers as well as mobile device manufacturers. As demand for high-performance, high-density mobile memory solutions in smaller package sizes continues to grow, the company plans to develop 6-layer 24GB and 8-layer 32GB modules into the thinnest LPDDR DRAM packages for future devices.
