Engineering publications brought to you by Mark Allen

Consumer

More demanding smartphone experiences drive innovation

MediaTek unveils the Dimensity 8400 for premium smartphones

NXP and geo develop Matter-enabled smart energy management solution

Smartphone production up 7% in 3Q24, according to TrendForce

xMEMS introduces 1-mm near-field full-range MEMS micro speaker

Winbond enhances LPDDR4/4X DRAM products for automotive applications

Nexperia’s latest gate drivers deliver efficiency and smoother motor control

Renesas collaborates with Intel delivering a PMIC solution for the Core Ultra 200V series

Micron launches ultra-fast clock driver DDR5 memory portfolio

Navitas GaNSlim power ICs target mobile, consumer, and home appliances

Silicon Labs and Kudelski IoT partner to accelerate Matter device certification

MediaTek unveils the Dimensity 9400 SoC