Said to be the world’s first chipset platform specifically optimised for 5G broadband IoT devices, it is intended to provide cost-effective support for applications including fixed wireless access, portable hotspots, mobile computing, video surveillance, and high-end industrial IoT.
“With our new Taurus platform, we are addressing the needs of the 5G broadband IoT industry,” said Bertrand Debray, EVP, Broadband IoT, Sequans. “Taurus provides all the capabilities expected for the support of enhanced broadband services, but it is tailored to fit the requirements of today’s most in-demand broadband IoT applications.”
Taurus 5G NR is highly integrated, supporting sub 6 GHz (FR1) radio in both standalone and non-standalone 5G NR with 4G LTE fallback and features a dedicated dual-core application processor with high-speed interfaces, including native Ethernet, to support a wide range of IoT customer applications.
The Taurus portfolio includes chipset and modules, with reference designs for fast time to market and design flexibility.
Main features include:
- 3GPP Release 17
- FR1: 600-7125 MHz
- SA, NSA, and CA for worldwide deployment
- LTE fallback for smooth migration from LTE to 5G
- SoC with dual-core APU for smart edge applications and integrated routers
- High speed interfaces including native Ethernet
“Initial 5G IoT uses came as no surprise: automotive, and fixed wireless terminals and gateways–namely, high bandwidth applications that can reuse chips originally developed for smartphones,” said Jamie Moss, Research Director, ABI Research. “But the rest of the IoT needs 5G silicon that has been acutely optimised: simpler, more efficient, more affordable, and not merely cut down or hobbled versions of higher performance chips.
“Economies of efficiency and effectiveness are intensely resource sensitive, and only fit-for-purpose designs can unlock the mass market potential for 5G in the IoT. Sequans’ Taurus is a 5G chip developed solely for broadband IoT. According to ABI Research, annual shipments for broadband IoT modules, containing the chips used in IoT devices, will grow to 217 million units globally by 2027.”
