Single chip audio subsystem offers 'bigger stereo'

The TS4982's 3D sound enhancement circuitry has been designed for closely spaced speakers to deliver greater stereo spatial effects. Applications include notebook PCs, mobile internet devices, gaming consoles and portable multimedia devices. The 3D effect is adjustable for low, medium or high volume levels, allowing equipment designers to optimise stereo enhancement according to the type and size of product. The level is set using two external pins on the device, and requires no additional circuitry. Michel Bendridi, technical marketing for audio products for ST's analogue and mixed signal products business unit, said: "To deliver the high quality sound consumers require in new and innovative small form factor products, leading computing and consumer manufacturers will need to incorporate chips like the TS4982 that offer highly integrated advanced 3D audio technology, at consumer price points." The audio subsystem includes a 2 x 2W stereo speaker driver; a 125mW stereo headphone driver; four step digital volume control; pop and click reduction circuitry to attenuate unwanted system noises and PC beep pass through capability. Separate Enable signals for the headphone and speaker drivers have been designed to allow low power consumption and the device draws a current of 10nA in shutdown mode.