According to the company, one of the biggest challenges when manufacturing dual interface cards is connecting the electronic module with the antenna, with mechanical-electrical problems leading to yield problems. Looking to overcome this and other issues, StarChip and its partners are working on a solution based on an ultra low power IC. This is intended to allow hardware simplification, cost reduction, better reliability and improved manufacturing yield.
“Thanks to this funding and the knowledge and expertise of all the partners involved in the LISA project, we are bringing a technology that will revolutionise the contactless market,” claimed Romain Palmade, StarChip’s contactless and NFC expert.
