The module has been specifically optimised to reduce the cost of adding Bluetooth low energy functionality to an IoT system. Its easy-to-use design and software will enable developers to quickly and intuitively develop highly functional connected devices, targeting the next generation of connected consumer, connected medical, smart home and smart appliance applications.
It incorporates two unique software features designed to eliminate the complexity often associated with traditional Bluetooth low energy development and empowers customers to develop robust IoT products regardless of their software coding capabilities.
The first is the configurable Dialog Serial Port Service (DSPS) software, which emulates a universal asynchronous receiver-transmitter (UART) serial port over BLE, removing the need to write Bluetooth software for “BLE Pipe” applications when connecting the module to a host MCU’s serial port. The second is Dialog’s new Codeless software, which takes this concept even further by replacing complex code with a simple series of human readable ASCII commands that can be used to generate customer applications. Codeless uses the industry standard Hayes AT-style command set to configure and operate the module.
The DA14531 module looks to leverage the capabilities of the SmartBond TINY DA14531 SoC, launched last year, and includes an integrated antenna and all the components required to add BLE functionality to an IoT system in high volumes at a cost of under $1. That price point for BLE functionality is unmatched by its competitors, according to Sean McGrath, Senior VP, Connectivity and Audio BG, Dialog Semiconductor. “Not only is this module breaking barriers in terms of cost and power, it is extremely easy for both beginners and experts to use, ensuring that all customers can benefit from its high level of integration and programmable ease of use.”
The hand solderable stamp type module offers 9 GPIO’s and measures 12.5 x 14.5mm in size. All external components, including passives, XTAL, antenna and FLASH memory, are integrated into the SmartBond TINY module, so that customers don’t need to source individual components separately.
The SmartBond TINY module is fully certified for worldwide operation, with FCC certification for the Americas and CE certification for Europe, so customers don’t need to certify platforms themselves, further reducing development time, effort and cost.
The module has also been effectively futureproofed, thanks to a combination of Bluetooth 5.1 compliance and support for over-the-air software updates.
Dialog’s DA14531 SoC and module are sampling now and available via DigiKey.
