The laboratory now offers a one-stop shop for critical qualification and testing of Smiths Interconnect’s semiconductor test products manufactured in China.
The test lab area was re-designed and additional test capabilities were added to enhance the company’s ability to quickly deliver products to the customer base in the Asia Pacific region and worldwide including: -
- A 67GHz Vector Network Analyzer to validate RF test performance of semiconductor test sockets.
- Two new multiple cycle testers that can support 5,000+ pin count, to validate electrical performance of high-count spring pin test sockets;
- A new Current Carrying Capacity tester to characterize temperature rise vs. current for electrical contacts.
- A Thermal Measurement system to evaluate heat-sinks for their effectiveness to cool highpower devices such as micro-processors.
- A laser cleaning machine to provide field maintenance recommendations and determine the products life cycle.
“The new test capabilities are a great addition to our existing equipment of Probe Card Analysers for WLCSP Probe heads” said Frank Zhou, Director of Product Engineering, APAC (Asia Pacific). “Our testing equipment enables us to quickly develop and deliver high quality, high performance semiconductor test products that meet our customers’ needs”.
