The rapid expansion of connected devices and data-intensive applications is driving demand for highly efficient and adaptive high-performance computing solutions. Mobile devices such as mobile phones, tablets and car infotainment systems now have increasingly sophisticated System-on-Chips (SoCs) and have to combine CPU, GPU, AI engine, camera processor, memory, and 5G modems in the smallest possible form factor.
With the need for increased functionality in the smallest possible footprint there has been a reduction of the pitch of integrated circuits below 500 μm. At the same time, increased performances in SoCs affect pin-to-pin noise or what is commonly called crosstalk during testing.
Despite great efforts to improve packet design, the reduction in size inevitably leaves critical high-speed signal lines susceptible to crosstalk, causing false failures during testing.
Smiths Interconnect is looking to address this with its latest DaVinci Technology.
The DaVinci Micro test socket leverages the DaVinci coaxial technology for integrated circuit (IC) applications to 350µm pitch to provide pin-to-pin isolation, negating the effect of cross talk during test, and substantially improving the accuracy of chip performance testing. Its design protects the small diameter signal probes and ensures that the product can be deployed and withstand the rigours of a production test environment.
“The addition of DaVinci Micro high-speed test socket will enable Smiths Interconnect to offer a solution that can significantly accelerate our customers’ innovation in high performance computing, graphics and adaptive SoCs technologies.” said Brian Mitchell, Vice President and General Manager of the Semiconductor Test Business Unit at Smiths Interconnect. “The fully shielded signal path of DaVinci Micro, which eliminates the negative effects of cross-talk during testing, allows for an immediate performance improvement that distinguishes it from non-DaVinci products.”
