ST announces 55nm eFlash process technology for automotive mcus
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STMicroelectronics has announced what it claims to be the world's first 55nm eFlash process technology for automotive microcontrollers. The technology will be implemented in its next generation automotive mcu chips.
The 55nm eFlash technology has been developed to address automotive market demands which are driving the technology beyond the performance currently delivered by 90nm based chips. According to ST, the technology will be the basis for its future automotive 32bit power architecture-based mcu roadmap.
Marco Monti, general manager of ST's Automotive Electronics Division, said: "Embedded Flash is an absolutely critical technology in a chip maker's arsenal to deliver cutting edge SoC ics for automotive applications. Both the development and manufacturing at our Crolles site will ensure the high quality and adequate supply for our automotive customers."
ST's eFlash technology has been developed, and also will be manufactured, at the company's Crolles facility. The first mcu products to implement the 55nm eFlash technology are expected to be available for customer sampling in mid 2011 and automotive qualification in 2013.
