STMicroelectronics shrinks chips by 83%
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STMicroelectronics has announced two chips for controlling antenna power in mainstream 3G wireless products that are 83% smaller than earlier components.
According to the semiconductor specialist, the devices are designed to improve energy efficiency to maximise battery life. The CPL-WB-00D3 and DCPL-WB-00D3 are single and dual path antenna couplers intended for single and dual antenna systems. By integrating attenuators on coupled and isolated ports, ST claims the antenna couplers simplify circuit design and save costs. This integration has been achieved using the company's Integrated Passive Device (IPD) technology.
The devices have been designed to address the issue of most couplers only measuring power radiated by an antenna in a forward direction. ST's bidirectional devices also measure reflected power to improve control and efficiency.
The CPL-WB-00D3 and DCPL-WB-00D3 are part of ST's miniature bidirectional couplers with IPD inductors and have dimensions of 1.3 by 1mm compared with earlier 1.7 by 1.4mm devices. Compatible with all 3G network standards, features include 50ohm nominal I/O impedance; an operating frequency range of 824 to 2170MHz and less than 0.2dB insertion loss.
Both devices are currently in volume production.
