TI has envelope tracking chip for LTE
Texas Instruments has introduced a new envelope tracking power supply solution, which it says reduces power consumption in 3G and 4G LTE multi-mode, multi-band rf power amplifiers used in smartphones and tablets.
The LM3290 step down converter with integrated dc boost and companion LM3291 linear amplifier enable the use of envelope tracking techniques in rf transmitters to reduce the power amplifier temperature by 20°C and reduce overall power consumption by 25%.
In addition, the devices are optimised to provide high efficiency at higher power output levels and high PAR, while meeting stringent receive band noise requirements in all LTE bands.
The chipset supports battery voltages down to 2.5V, and is optimised to achieve greater than 90% efficiency.
