Toshiba now sampling UFS 2.0-compliant NAND flash
Toshiba has started sampling 32 and 64GB embedded NAND flash memory modules compliant with the JEDEC UFS 2.0 standard.
The devices integrate two 5.8Gb/s high speed MIPI M-PHY HS-G3 I/F data lanes, enabling maximum transfer rates of 11.6Gb/s. Toshiba says they achieve read speeds of 650MB/s and write speeds of 180MB/s.
The memory modules are available in 153 ball FBGA packages measuring 11.5 x 13 x 1mm for the 32GB die and 11.5 x 13 x 1.2mm for the 64GB die. They are rated for an operating temperature of -25 to 85°C and support memory core voltages of 2.7 to 3.6V.
The JEDEC UFS Ver.2.0 compliant interface handles essential functions, including writing block management, error correction and driver software.
Toshiba says it will schedule mass production and add other densities "in response to market demand".
