This advanced process complements Tower's established 200mm (PH18) platform that is in high-volume production today, providing the foundry’s customers with a cutting-edge solution that’s been tailored to meet the needs of high-speed data communications for next generation datacom applications.
The 300mm offering features best-in-class silicon waveguides and the most advanced low-loss silicon nitride waveguide offerings in the industry.
As a consequence of the larger wafer size, it is possible to enhance compatibility with industry-standard OSAT (Outsourced Semiconductor Assembly and Test) platforms, and it helps to facilitate the seamless integration with electronic components and improving overall efficiency.
"The introduction of this highly advanced Silicon Photonics offering, provides a seamless path for our existing customers to transition to next-generation technology on 300mm wafers,” said Dr. Edward Preisler, Vice President and General Manager of RF Business Unit.
“This process builds on Tower’s industry-leading 200mm SiPho platform both in terms of continuous process enhancements and increasing flexibility of supply for our customers."
