TSMC claims 28nm leadership

"Achieving … yield across all three 28nm process nodes is striking," said Dr Jack Sun, pictured, TSMC's vp of R&D. "It is particularly noteworthy because this achievement demonstrates the manufacturing benefits of the gate-last approach that we developed for the two 28nm high-k metal gate processes." TSMC has three 28nm processes: low power (LP); high performance (HP); and low power with high-k metal gate (HPL). The latter is a new addition to the portfolio, offering low power and low leakage with medium high performance. According to the company, 28nm process developments have been 'on track' since their announcement last September. The 28LP process is expected to enter risk production at the end of Q1 of 2010, followed closely by the 28HP risk production at the end of Q2 and the 28HPL risk production in Q3. "This accomplishment … shows TSMC is not only able to extend conventional SiON technology to 28nm, but is also able to deliver the right 28nm HKMG technology at the same time," added Dr Mark Liu, senior vp of TSMC's Advanced Technology Business.