TSMC completes 28nm process, says 89 tape outs scheduled
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TSMC's 28nm manufacturing process roll out has been completed and the company has 89 designs scheduled to tapeout on the 28nm process.
"Customers can immediately take advantage of our 28nm advanced technology and manufacturing capacity, while preparing for 20nm in the near future," said Cliff Hou, TSMC's senior director, design and technology platform.
As part of the roll out, the company is also introducing enhancements to its Open Innovation Platform, including the delivery of Reference Flow 12.0 and Analogue/Mixed Signal Reference Flow 2.0.
Reference Flow 12.0 features enhancements in areas such as 2.5d and 3d circuits using silicon interposer and through silicon via technologies, as well as 28nm model based simulation and advanced electronic system level design.
In addition, Reference Flow 12.0 will feature TSMC's 20nm Transparent Double Patterning design solution. This highlights the growing problems manufacturers face with current lithography systems. Double patterning is one of the last steps available before a move to extreme ultraviolet technology is needed. TSMC says Transparent Double Patterning enables 20nm chip designs to be undertaken without modifications to current design flows.
Reference Flow 12.0 also introduces an enhanced routing methodology to minimise via counts, change layers for routing or widen wires to mitigate the impact of wire and via resistance.
