The partnership is based on SkyWater implementing VORAGO’s patented HARDSIL technology, which is a cost-effective semiconductor processing method that enables devices to operate at higher temperature and radiation levels.
HARDSIL will now be available to SkyWater customers as a design-enabled processing method for new or existing designs without any impact on die size, specification, and without the need for any redesign. HARDSIL will enhance SkyWater’s bulk 90 nm CMOS process for commercial use in space, aviation, industrial, and medical applications that require higher levels of radiation tolerance.
In contrast to standard commercial design and manufacturing processes, high-reliability radiation-hardened (rad-hard) electronic components must be designed and manufactured so that exposure to ionizing radiation and/or extreme temperatures does not result in malfunctions or catastrophic failure. VORAGO has developed innovative technology which enables meeting rad-hard performance without requiring design changes – eliminating or reducing the need for costly and time-consuming adjustments or modifications.
Recently, the US has made the strengthening of domestic semiconductor manufacturing capabilities a major priority. As the semiconductor industry experiences silicon shortages, SkyWater’s fab and VORAGO’s technology are positioned to domestically source these important components for use in commercial as well as aerospace and defence applications.
“We are pleased VORAGO has chosen SkyWater as its preferred foundry,” said Thomas Sonderman, president and CEO of SkyWater. “Implementing their HARDSIL technology enhances our bulk 90 nm CMOS process by enabling applications in commercial and other markets that require high levels of radiation tolerance. VORAGO’s choice to move all their manufacturing to the US is commendable as the nation continues its reshoring efforts for national and economic security.”
HARDSIL is a patented, node-, foundry- and product-agnostic solution that utilises a few additional implant modules based on standard fab equipment, allowing for the fabrication of rad-hard electronic components. HARDSIL easily incorporates exceptional rad-hard capability into standard semiconductor IC creation and is a cost-effective modification to commercial process flows that can be implemented quickly with minimal incremental mask and implant steps.
VORAGO has developed multiple products using HARDSIL and it has been used under license by other leading semiconductor suppliers.
