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Space
EnSilica to develop satellite communications chip for terminals
20 Feb 2023
Electronics
Winbond joins UCIe Consortium to support chiplet interface standardisation
20 Feb 2023
5G
Arctic Semiconductor ships IceWings, its first 5G RF chipset
17 Feb 2023
Automotive
ServCity consortium brings autonomous mobility a step closer to deployment in UK’s cities
17 Feb 2023
Memory
The Six Semiconductor announces tape-out of two 7nm test chips
17 Feb 2023
EDA & Design Software
Tachyum validates Prodigy Universal Processor with Kubernetes
17 Feb 2023
Sensors
Oculi forms strategic partnership with GlobalFoundries
17 Feb 2023
EDA & Design Software
Cadence delivers 13 new VIP solutions
17 Feb 2023
Electronics
Texas Instruments selects Utah for its next 300mm wafer fab
16 Feb 2023
Sensors
Murata unveils highly accurate soil monitoring system
16 Feb 2023
Interconnection
NTU scientists develop ‘Lego-like’ universal connector
16 Feb 2023
Power
CAP-XX launches ultra-thin prismatic supercapacitor for space-constrained devices
16 Feb 2023
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