Engineering publications brought to you by Mark Allen

News

Electronics

First silicon-proven 3nm 24 Gbps UCIe subsystem validated

Test & Measurement

Pico Technology expands PicoScope 3000E series with MSO models

Automotive

MIPI releases A-PHY v2.0 doubling maximum data rate of automotive SerDes interface

Electronics

Sony Semiconductor Solutions and Raspberry Pi launch Raspberry Pi AI Camera

Embedded & Programmable

AMD expands automotive-grade FPGAs portfolio

EDA & Design Software

Siemens extends collaboration with TSMC to advance IC and systems design

Electronics

Semiconductor industry to invest $400bn in 300mm Fab equipment

EDA & Design Software

TSMC and Cadence to deliver advanced-node design flows and 3D-IC solutions

Memory

SK hynix begins volume production of 12-Layer HBM3E

Communications

SIAE MICROELETTRONICA selects EnSilica to design ASICs for next-generation telecom equipment

Sensors

Quantum space sensor to fight climate change

Electronics

Broadcom delivers 200G/lane DSP for Gen AI infrastructure