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News
eYs3D Microelectronics raises $7m in Series A funding
26 May 2021
Consumer
Huawei looking to launch new operating system for phones
26 May 2021
ASIC & SoC
Third-generation 112G-LR SerDes IP
25 May 2021
Board Level Design
Farnell stocks OrangeCrab FPGA development board
25 May 2021
Embedded Systems
ADLINK unveils first PC/104 module with quadro P1000 graphics
25 May 2021
ASIC & SoC
GUC announces GLink-3D Die-on-Die interface IP
25 May 2021
Consumer
GaN InnoSwitch4-CZ ICs selected for USB-C Nano II chargers
25 May 2021
Board Level Design
Cadence unveils low-power IP for PCI Express 5.0 specification on TSMC N5 process
25 May 2021
Policy & Business
DALI Alliance adopts Thread for DALI+
24 May 2021
Embedded Software
IAR Embedded Workbench supports all NXP i.MX RT crossover MCUs
24 May 2021
Memory
Avery Design extends collaboration with Rambus
24 May 2021
RF & Microwave
Digi-Key signs distribution partnership agreement with Mini-Circuit
24 May 2021
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