Engineering publications brought to you by Mark Allen

Product Launches

Power

LDOs in low profile packaging

Power

Switcher addresses power density

Power

Surface mount converters with IC style packaging

Manufacturing

Enclosed fan cooled models added to power supply range

Power

Graphical interface eases designs

Automotive

Flyback controllers provide high maximum junction temperature

System Design

Optimised design for synchronous buck regulator

Communications Hardware

Compact evaluation modules

Embedded Software

Platform speeds development of Intel Atom embedded systems

Displays

Optical transceiver modules

Power

Okami range increased

Power

New MOSFET devices