Engineering publications brought to you by Mark Allen

Product Launches

CPUs

Toshiba releases MCUs with expanded code Flash memory capacity

Power

Infineon SSO10T TSC top-side cooling package for power MOSFETs

Embedded Software

NEXCOM announces rugged, sunlight-readable panel PC for semi-outdoor interactive applications

Embedded Systems

congatec expands modular edge server ecosystem

Power

Infineon extends XDP digital power protection controller family

Sensors

Micropower Hall-Effect switches compatible with low-voltage chipsets

Embedded Systems

NEXCOM launches TCA 6710 1U rackmount COM-HPC module

Internet of Things

Amphenol RF introduces Wi-Fi 6E antennas

Interconnection

Harwin introduces range of floating connectors

Communications Hardware

u-blox launches new GNSS platform targeting urban environments

Embedded Systems

Kontron to unveil new Control Panel product line

Interconnection

Fibre optic connectors support communications in harsh environments